Abstract
We construct a new procedure for clustering partially masked images from wafer bin maps (WBMs). A WBM is an image of bin codes from circuit probe tests on a wafer after a semiconductor manufacturing process. Certain defect patterns of WBMs provide engineers with information to isolate manufacturing problems. However, some WBMs may be masked at a small or large area due to the sequential circuit probe tests for bin codes. We proposed a new modified Radon transformation to extract features for better clustering. We demonstrated our procedure on synthetic WBMs with various defect patterns and levels of masking through a simulation study.